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Smart Silicon MEMS Prototyping and Manufacture

 
Use INTEGRAMplus for the development and commercialisation of discrete or integrated microsystems for physical sensing, actuation, microfluidic and optical applications.
Smart Silicon MEMS Prototyping and Manufacture
Choose from cost-efficient multi-project wafer (MPW) runs and more flexible single-project wafer (SPW) services for discrete MEMS. For more specialised requirements (including monolithic integration), a full custom service is available. This is based on custom sequences of standard steps where possible to reduce cost.

Select from 3 core MEMS process technologies:
  • Polysilicon surface micromachining (PPK).
  • Metal-nitride surface micromachining (MPK) (CMOS compatible).
  • DRIE (Deep Reactive Ion Etch) - based high aspect ratio micromachining of SOI (silicon on insulator).

The SOI DRIE process enables high aspect ratio structures and employs a thicker structural layer (10-100μm) than the surface micromachining processes (0.3-3μm). Each process is supported by a design handbook containing information to enable a designer to simulate and design devices. This has already been encoded into CAD support files for L-Edit™ and CoventorWare™.
Smart Silicon MEMS Prototyping and Manufacture
Use INTEGRAMplus for access to MEMS foundry manufacturing in a state-of-the-art 6 inch wafer fab. Optional through-wafer via technology offers a low-cost solution for wafer-level packaging and surface mount assembly allowing electrical connections from the front to the back surface of a wafer.
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